chip inductors ? l3 series note: specifications subject to change w ithout notice. please check our we bsite for latest information. proprietary and confidential document of superworld 14/08/2017 p1 1. part no. expression: l 3 ? 4 7 n k - (a) (b) (c) (d) (a) series code (c) tolerance code (b) inductance code (f) 10: standard code 2. configuration & dimensions : a b c d g h l 2.00 0.20 1.25 0.20 see table below 0.50 0.30 1.00 ref. 1.45 ref. 3.10 ref. 3. schematic 4. material list unit: mm
chip inductors ? l3 series note: specifications subject to change w ithout notice. please check our we bsite for latest information. proprietary and confidential document of superworld 14/08/2017 p2 5. general specification a) operating temperature: - 40c to + 105c (including self-temperature rise) b) storage condition (component in its packaging) i) temperature: less than 40c ii) humidity: 60% rh 6. electrical characteristics part no. dimension c (mm) inductance (uh) q rated current (ma) max. dcr ( ? ) max. srf (mhz) min. tolerance test frequency (hz) min. test frequency (mhz) l3-47n -10 0.850.20 0.047 60mv / 50m 15 50 300 0.20 320 l3-68n -10 0.850.20 0.068 60mv / 50m 15 50 300 0.20 280 l3-82n -10 0.850.20 0.082 60mv / 50m 15 50 300 0.20 255 l3-r10 -10 0.850.20 0.10 60mv / 25m 20 25 250 0.30 235 l3-r12 -10 0.850.20 0.12 60mv / 25m 20 25 250 0.30 220 l3-r15 -10 0.850.20 0.15 60mv / 25m 20 25 250 0.40 200 l3-r18 -10 0.850.20 0.18 60mv / 25m 20 25 250 0.40 185 l3-r22 -10 0.850.20 0.22 60mv / 25m 20 25 250 0.50 170 l3-r27 -10 0.850.20 0.27 60mv / 25m 20 25 250 0.50 150 l3-r33 -10 0.850.20 0.33 60mv / 25m 20 25 250 0.55 145 l3-r39 -10 0.850.20 0.39 60mv / 25m 25 25 200 0.65 135 l3-r47 -10 1.250.20 0.47 60mv / 25m 25 25 200 0.65 125 l3-r56 -10 1.250.20 0.56 60mv / 25m 25 25 150 0.75 115 l3-r68 -10 1.250.20 0.68 60mv / 25m 25 25 150 0.80 105 l3-1r0 -10 0.850.20 1.0 60mv / 10m 45 10 50 0.40 75 l3-1r5 -10 0.850.20 1.5 60mv / 10m 45 10 50 0.50 60 l3-1r8 -10 0.850.20 1.8 60mv / 10m 45 10 50 0.60 55 l3-2r2 -10 0.850.20 2.2 60mv / 10m 45 10 30 0.65 50 l3-2r7 -10 1.250.20 2.7 60mv / 10m 45 10 30 0.75 45 l3-3r3 -10 1.250.20 3.3 60mv / 10m 45 10 30 0.80 41 l3-4r7 -10 1.250.20 4.7 60mv / 10m 45 10 30 1.00 35 l3-100 -10 1.250.20 10.0 60mv / 2m 45 2 15 1.15 24 note: tolerance: k=10%, l=15%, m=20%
chip inductors ? l3 series note: specifications subject to change w ithout notice. please check our we bsite for latest information. proprietary and confidential document of superworld 14/08/2017 p3 7. characteristics curves l ? vs ? idc ? q ? vs ? freq. ?
chip inductors ? l3 series note: specifications subject to change w ithout notice. please check our we bsite for latest information. proprietary and confidential document of superworld 14/08/2017 p4 8. soldering mildly activated rosin fluxes are preferred. the termina tions are suitable for re-flow soldering systems. if hand soldering cannot be avoided, the preferred techniqu e is the utilization of hot air soldering tools. note: if wave soldering is used, there will be some risk. re-flow soldering temperatures below 240c, there will be non-wetting risk 8-1 solder re-flow: recommended temperature profiles for lead free re-flow soldering in figure 1. 8-2 soldering iron (figure 2): products attachment with soldering iron is discoura ged due to the inherent proce ss control limitations. in the event that a soldering iron must be employed the following precautions are recommended. note: a) preheat circuit and products to 150c. b) 350c tip temperature (max.) c) never contact the ceramic with the iron tip d) 1.0mm tip diameter (max.) e) use a 20 watt soldering iron with tip diameter of 1.0mm f) limit soldering time to 4~5 secs. 8-3 soldering volume: accordingly increasing the solder volume, the mechan ical stress to product is also increased. exceeding solder volume may cause the failure of mechanical or electrical performance. solder shall be used not to be exceeding as shown in the figure 3. minimum fillet height = soldering thickness + 25% product height.
chip inductors ? l3 series note: specifications subject to change w ithout notice. please check our we bsite for latest information. proprietary and confidential document of superworld 14/08/2017 p5 9. packaging information 9-1 reel dimension type a (mm) b (mm) c (mm) d (mm) 7? x 8mm 9.0 0.5 60.0 2.0 13.5 0.5 178.0 2.0 9-2 tape dimension material of taping is paper size bo(mm) ao(mm) ko(mm) p(mm) t(mm) 201209 2.100.05 1.300.05 0.95 0.05 4.00.10 0.950.05
chip inductors ? l3 series note: specifications subject to change w ithout notice. please check our we bsite for latest information. proprietary and confidential document of superworld 14/08/2017 p6 material of taping is plastic 9-3. packaging quantity size 201209 201212 chip/ reel 4000 2000 inner box 20000 10000 middle box 100000 50000 carton 200000 100000 9-4. tearing off force size bo(mm) ao(mm) ko(mm) p(mm) t(mm) d1(mm) 201212 2.100.10 1.280. 10 1.280.10 4.00. 10 0.220.05 1.00.10 the force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. room temp (c) room humidity (%) room atm (hpa) tearing speed (mm/min) 5 - 35 45 - 85 860 - 1060 300
chip inductors ? l3 series note: specifications subject to change w ithout notice. please check our we bsite for latest information. proprietary and confidential document of superworld 14/08/2017 p7 application notice: 1. storage conditions: to maintain the solderabililty of terminal electrodes: a) recommended products should be used within 12 months from the time of delivery. b) the packaging material should be kept where no chlorine or sulfur exists in the air. 2. transportation: a) products should be handled with care to avoid damage or contamination from perspiration and skin oils. b) vacuum pick up is strongly recommended for individual components. c) bulk handling should ensure that abrasion and mechanical shock are minimized.
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